1. 2. 3. material content data sheet sales product name ipp110n20n3 g issued 29. august 2013 ma# MA000811282 package pg-to220-3-1 weight* 2038.32 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 17.562 0.86 0.86 8616 8616 leadframe non noble metal iron 7439-89-6 0.816 0.04 401 inorganic material phosphorus 7723-14-0 0.245 0.01 120 non noble metal copper 7440-50-8 815.335 40.00 40.05 400003 400525 wire non noble metal aluminium 7429-90-5 11.929 0.59 0.59 5853 5853 encapsulation organic material carbon black 1333-86-4 5.733 0.28 2813 plastics epoxy resin - 108.926 5.34 53439 inorganic material silicondioxide 60676-86-0 458.637 22.50 28.12 225007 281259 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10529 10529 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder non noble metal antimony 7440-36-0 0.719 0.04 353 noble metal silver 7440-22-4 1.799 0.09 882 non noble metal tin 7440-31-5 4.676 0.23 0.36 2294 3529 heatspreader non noble metal iron 7439-89-6 0.590 0.03 290 inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal copper 7440-50-8 589.466 28.92 28.96 289192 289569 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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